YES (Yield Engineering Systems), a leading provider of high-performance process solutions for the semiconductor Advanced Packaging market, today announced that Rezwan Lateef has been appointed Chief Executive Officer. Mr. Lateef previously served as President of YES and has been a key driver of the company’s significant growth, global expansion, and product innovation over the past several years.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251202200541/en/
Rezwan Lateef, CEO of YES.
The transition marks a natural progression for the company as it surpasses a key revenue milestone and enters its next phase of scaling with top tier semiconductor and AI computing customers.
Rama Alapati, who has served as CEO since 2021, will step into a consulting role to support Mr. Lateef during the transition period and ensure strong organizational continuity.
“Rama has played an instrumental role in elevating YES from a promising technology company into a recognized leader in Advanced Packaging,” said Rezwan Lateef. “His commitment and leadership have been central to our transformation. I am grateful for his partnership, and I am pleased that he will continue to support me during this transition.”
Under Mr. Lateef’s leadership, YES will continue strengthening its relationships with industry-leading customers and advancing technology solutions for the rapidly growing AI and High-Performance Computing markets. The company’s strategic priorities include accelerating development of new systems for next-generation packaging architectures and expanding the innovative solutions that help customers meet the demands of the rapidly growing AI and High-Performance Computing markets.
“We are very bullish and remain highly confident in the future of YES,” said Nety Krishna, Senior Managing Director, representing KCK - the company’s primary investor. “The company has invested heavily in product development and is well positioned at key customers in the rapidly expanding segment of Advanced Packaging. This leadership transition reflects our long-term commitment to supporting YES through its next stage of growth.”
Mr. Lateef added, “YES has an exceptional team, an expanding global footprint, and a clear technology roadmap aligned with the needs of our customers. I look forward to leading this next chapter as we continue to scale, innovate, and increase the value we deliver to the industry.”
The leadership transition is effective immediately.
About YES
YES is a leading provider of differentiated technologies for materials and interface engineering. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems, and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via, Cavity Etch, and Electroless Deposition tools for the semiconductor industry. Headquartered in Fremont, California, YES has a growing global presence. Please visit YES.tech.
View source version on businesswire.com: https://www.businesswire.com/news/home/20251202200541/en/
Contact details:
Media contact:
Alex Chow
[email protected]
